ALD
What is ALD?
Atomic Layer Deposition (ALD) is a thin-film deposition technique that deposits materials one atomic layer at a time. It is a self-limiting process based on sequential surface reactions. ALD is used to create highly conformal and uniform thin films for microelectronics, nanotechnology, and other applications where precise control over film thickness and composition is required. Common applications include semiconductor manufacturing, coating of nanoparticles, and fabrication of barrier layers.
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