Sputtering is a physical vapor deposition (PVD) technique used to deposit thin films onto a substrate. It involves bombarding a target material (the source) with energetic ions, typically noble gas ions like argon. The impact of these ions causes atoms or molecules from the target to be ejected (sputtered) and subsequently deposited onto the substrate, forming a thin film. Sputtering is widely used in various applications, including microelectronics (e.g., integrated circuit fabrication, hard drive coatings), optical coatings (e.g., anti-reflective coatings), and decorative coatings.
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