RIE Insights | Sumble

What is RIE?

RIE typically refers to Reactive Ion Etching. It's a microfabrication technique used to selectively remove material from a surface using chemically reactive plasma. It's commonly used in semiconductor manufacturing to create patterns on wafers by etching away material that isn't protected by a mask.

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What other technologies are related to RIE?

RIE Competitor Technologies

PECVD

PECVD is another plasma-based deposition technique that can be used to deposit thin films. It can be a competitor because it's an alternative method for achieving similar results to RIE in certain applications, especially deposition.

mentioned alongside RIE in 8% (152) of relevant job posts

dry etch

Dry etching is a broader category that encompasses RIE. Other dry etching techniques such as deep RIE and isotropic etching compete with RIE for etching applications.

mentioned alongside RIE in 11% (72) of relevant job posts

CVD

Chemical Vapor Deposition is a thin film deposition technique. CVD can be an alternative to etching in some applications where material removal is achieved through deposition of a masking layer instead of direct etching.

mentioned alongside RIE in 3% (78) of relevant job posts

RIE Complementary Technologies

photolithography

Photolithography is used to pattern the surface before RIE. RIE then etches away the unprotected areas of the surface, making it a crucial step in microfabrication sequences.

mentioned alongside RIE in 4% (94) of relevant job posts

ALD

Atomic Layer Deposition is a thin film deposition technique. ALD can be used to deposit hardmasks for RIE or to deposit films after RIE.

mentioned alongside RIE in 4% (86) of relevant job posts

ICP

Inductively Coupled Plasma is a type of plasma source that can be used in RIE systems to generate high-density plasmas, enhancing the etch rate and anisotropy. Therefore, ICP is often used to enhance RIE performance.

mentioned alongside RIE in 1% (112) of relevant job posts