CMP
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Explore more → What is CMP?
CMP commonly refers to Chemical-Mechanical Planarization (or Polishing). It is a process used in semiconductor manufacturing to planarize (flatten) the surface of a wafer by combining chemical etching and mechanical abrasion. It's crucial for creating the multiple layers of integrated circuits found in modern electronics. CMP is also used outside of IC fabrication such as in the creation of optical components.
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