BGA
**BGA**
What is BGA?
BGA stands for Ball Grid Array. It is a type of surface-mount packaging used for integrated circuits. BGAs are characterized by solder balls arranged in a grid pattern on the underside of the package. These solder balls provide electrical connections and mechanical support to the printed circuit board (PCB). BGAs offer higher pin counts and improved thermal performance compared to other packaging types like DIP or QFP. They are commonly used in devices requiring high density and performance such as CPUs, GPUs, and memory chips.
What other technologies are related to BGA?
BGA Competitor Technologies
BGA Complementary Technologies
Which job functions commonly mention BGA?
Which organizations are mentioning BGA?
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