What is WLCSP?

WLCSP (Wafer Level Chip Scale Package) is an integrated circuit packaging technology where the integrated circuit is packaged at the wafer level, before it is singulated into individual dies. It is a true chip-scale package because the resulting package has the same size as the die. This technology is commonly used in applications requiring small form factors, high performance, and low cost, such as mobile devices and other portable electronics. WLCSP offers excellent thermal and electrical performance due to its short interconnects and direct connection to the PCB.