wire bonding
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What is wire bonding?
Wire bonding is a method of making electrical interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication. It is a vital process used to connect the die to lead frame of a microchip.
What other technologies are related to wire bonding?
wire bonding Competitor Technologies
flip chip
Flip chip is an alternative method of connecting a die to a substrate, where the die is flipped over and directly connected using solder bumps, eliminating the need for wire bonds.
soldering
Soldering is a more general connection technique. It can be considered a competitor when used as an alternative to wire bonding for electrical connections, though less common for die-level interconnect.
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wire bonding Complementary Technologies
Die Attach
Die attach is a necessary step before wire bonding, as the die needs to be attached to the substrate before wires can be bonded to it.
die bonding
Die bonding is a necessary step before wire bonding, as the die needs to be bonded to the substrate before wires can be bonded to it. 'Die attach' and 'die bonding' are often used interchangeably.
molding
Molding is often used after wire bonding to protect the delicate wires and the die from environmental factors.
Number of organizations that mention technology
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Which job functions commonly mention wire bonding?
Package Designer
0.3% of all Package Designer jobs mention wire bonding
View 14
jobs on Sumble
Warehouse
73 Warehouse jobs mention wire bonding
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jobs on Sumble
Chip Designer
20 Chip Designer jobs mention wire bonding
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jobs on Sumble
Frontline & Manual Labor
237 Frontline & Manual Labor jobs mention wire bonding
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jobs on Sumble
Engineering & R&D
222 Engineering & R&D jobs mention wire bonding
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jobs on Sumble
Which organizations are mentioning wire bonding?
Sandia National Laboratories
Other Services (except Public Administration)
West Virginia University
Educational Services
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