underfill
**underfill**
What is underfill?
Underfill is a polymeric material (often epoxy-based) applied to the periphery of a microelectronic component (like a flip-chip) after it has been attached to a printed circuit board (PCB). It flows by capillary action into the narrow gap between the component and the board, then is cured. Underfill's primary purpose is to enhance the mechanical strength and reliability of the solder joints that connect the component to the board, protecting them from stresses caused by thermal cycling, mechanical shock, and vibration. It also improves resistance to moisture and corrosion.
What other technologies are related to underfill?
underfill Complementary Technologies
Which job functions commonly mention underfill?
Which organizations are mentioning underfill?
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