reactive ion etching
What is reactive ion etching?
Reactive-ion etching (RIE) is a dry etching process used in microfabrication. It uses chemically reactive plasma to remove material from a wafer. The plasma is generated under low pressure in a radio frequency (RF) field. Reactive ions, accelerated from the plasma towards the material, chemically react with it to form volatile products that are then pumped away. RIE is commonly used for etching silicon, silicon dioxide, silicon nitride, and various metals in the production of integrated circuits, MEMS, and other microfabricated devices.
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