physical vapor deposition Insights

What is physical vapor deposition?

Physical Vapor Deposition (PVD) is a process used to produce thin films and coatings. It involves vaporizing a solid material in a vacuum environment and then depositing it onto a substrate. Common applications include creating wear-resistant coatings on tools, decorative coatings on consumer products, and functional layers in electronic devices.

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What other technologies are related to physical vapor deposition?

physical vapor deposition Competitor Technologies

chemical vapor deposition

CVD is a competing thin film deposition technique, although it relies on chemical reactions rather than physical processes.

mentioned alongside physical vapor deposition in 56% (291) of relevant job posts

atomic layer deposition

ALD is another thin film deposition technique that offers precise control over film thickness and conformality, but utilizes sequential self-limiting surface reactions, making it a competitor to PVD in some applications.

mentioned alongside physical vapor deposition in 48% (246) of relevant job posts

plasma enhanced chemical vapor deposition

PECVD is a variant of CVD that uses plasma to enhance chemical reactions, enabling deposition at lower temperatures, making it a competitor to PVD.

mentioned alongside physical vapor deposition in 66% (131) of relevant job posts

physical vapor deposition Complementary Technologies

Plasma Reactive Ion Etch

RIE is used for etching materials, often after a PVD coating. It can complement PVD processes.

mentioned alongside physical vapor deposition in 100% (98) of relevant job posts

Capacitively Coupled Plasma

CCP is a type of plasma source that can be used in some PVD systems to enhance the deposition process.

mentioned alongside physical vapor deposition in 97% (88) of relevant job posts

atomic layer etching

ALE is an etching technique that removes material one atomic layer at a time. It complements PVD processes by providing a means for precise material removal.

mentioned alongside physical vapor deposition in 81% (88) of relevant job posts