Atomic Layer Deposition (ALD) is a thin film deposition technique based on the sequential use of self-limiting gas-phase chemical reactions. It is a vapor phase technique and a subclass of chemical vapor deposition, but the process chemistry is quite different. Due to the self-limiting nature, ALD enables precise control of thickness and conformality of the deposited films, making it useful in manufacturing semiconductors, solar cells, and other nanotechnology applications.
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