Wet etching is a microfabrication process that uses liquid chemicals to remove material from a substrate. It is commonly used in semiconductor manufacturing, MEMS fabrication, and other applications where precise material removal is required. Wet etching can be isotropic (etching in all directions equally) or anisotropic (etching preferentially in one direction). Common etchants include acids (like hydrofluoric acid for silicon dioxide) and bases (like potassium hydroxide for silicon).
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