wafer bonding
**wafer bonding**
What is wafer bonding?
Wafer bonding is a technology used to join two or more wafers together, typically of semiconductor materials, to create a single, integrated structure. It's commonly used in the fabrication of microelectromechanical systems (MEMS), stacked integrated circuits (3D ICs), silicon-on-insulator (SOI) wafers, and advanced packaging solutions. The process involves cleaning and preparing the surfaces of the wafers, bringing them into intimate contact, and then applying heat and/or pressure to create a permanent bond.
What other technologies are related to wafer bonding?
wafer bonding Complementary Technologies
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