UCIe (Universal Chiplet Interconnect Express) is an open industry standard for die-to-die interconnects. It enables the creation of modular chip designs by allowing different chiplets from various vendors and process technologies to be interconnected within a package, effectively creating a larger, more complex System-on-a-Chip (SoC). This approach is used to improve performance, reduce costs, and accelerate time-to-market for advanced computing applications.
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