What is TAL?

TAL (Tape Automated Bonding) is a microelectronic packaging technology where integrated circuits (ICs) are attached to flexible substrates using a thin, patterned metal tape. It's used to connect the IC to the external circuitry. While not as common as wire bonding or flip-chip, it was historically important in applications requiring high density and fine pitch connections, such as display drivers and memory modules. However, modern manufacturing techniques have largely replaced TAL with more efficient methods.