Tech Insights

Surface Mount Technology (SMT)

Last updated May 19, 2025, generated by Sumble

What is Surface Mount Technology (SMT)?

Surface Mount Technology (SMT) is a method for producing electronic circuits in which components are mounted directly onto the surface of printed circuit boards (PCBs). SMT components are smaller than their through-hole counterparts and have leads that are designed to be soldered to the surface of the board rather than inserted through holes. SMT allows for higher component density, faster assembly, and lower costs compared to through-hole technology. It is widely used in modern electronics manufacturing.

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What other technologies are related to Surface Mount Technology (SMT)?

Surface Mount Technology (SMT) Competitor Technologies

Through-Hole Technology (THT)

THT involves inserting component leads through holes in a printed circuit board (PCB) and soldering them on the opposite side. While less automated and generally larger than SMT, it provides stronger mechanical bonds and can be more suitable for certain high-stress applications or larger components.

mentioned alongside Surface Mount Technology (SMT) in 69% (11) of relevant job posts

Chip-on-Board (COB)

COB involves directly mounting a bare silicon die onto a PCB and connecting it using wire bonding or flip-chip techniques. This can achieve high density and good thermal performance, potentially being a competitive alternative in some niche applications where miniaturization and thermal management are critical.

mentioned alongside Surface Mount Technology (SMT) in 15% (2) of relevant job posts

Surface Mount Technology (SMT) Complementary Technologies

Through-Hole Technology (THT)

While SMT is dominant, THT is still used for components that require high mechanical strength or handle significant power, complementing SMT's suitability for smaller, less demanding components.

mentioned alongside Surface Mount Technology (SMT) in 69% (11) of relevant job posts