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Physical Vapor Deposition (PVD)

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**Physical Vapor Deposition (PVD)**

What is Physical Vapor Deposition (PVD)?

Physical Vapor Deposition (PVD) is a vacuum coating process used to produce thin films and coatings. It involves vaporizing a solid material in a vacuum environment and depositing it onto a substrate. Common PVD techniques include sputtering, evaporation, and ion plating. PVD coatings are widely used to improve the hardness, wear resistance, and corrosion resistance of materials, and are often applied to cutting tools, decorative finishes, and optical components.

Find 56 organizations using Physical Vapor Deposition (PVD) on Sumble →

What other technologies are related to Physical Vapor Deposition (PVD)?

Physical Vapor Deposition (PVD) Competitor Technologies

Chemical Vapor Deposition (CVD)
Chemical Vapor Deposition (CVD)
CVD is a competing thin film deposition technique that uses chemical reactions of gaseous precursors on a substrate.
Atomic Layer Deposition (ALD)
Atomic Layer Deposition (ALD)
No summary available
ALD is another thin film deposition technique that uses sequential, self-limiting chemical reactions to deposit thin films with atomic-level control. It can be a competitor for applications where highly conformal coatings are required.
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Plasma Enhanced Chemical Vapor Deposition (PECVD)
No summary available
PECVD is a variant of CVD that uses plasma to enhance the chemical reactions, allowing for lower deposition temperatures. It competes with PVD in certain applications.
Number of organizations that mention technology
56
Physical Vapor Deposition (PVD)
55
Chemical Vapor Deposition (CVD)
33
Atomic Layer Deposition (ALD)
18
Plasma Enhanced Chemical Vapor Deposition (PECVD)
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Physical Vapor Deposition (PVD) Complementary Technologies

Atomic Layer Etching (ALE)
Atomic Layer Etching (ALE)
No summary available
ALE is a technique used to etch materials with atomic-level precision. It can be used in conjunction with PVD for creating complex structures.
Capacitively Coupled Plasma (CCP)
Capacitively Coupled Plasma (CCP)
No summary available
CCP is a type of plasma source that can be used to enhance PVD processes, such as sputter deposition.
Reactive Ion Etching (RIE)
Reactive Ion Etching (RIE)
No summary available
RIE is an etching technique that uses chemically reactive plasma to remove material. It can be used alongside PVD for pattern transfer or substrate cleaning.
Number of organizations that mention technology
56
Physical Vapor Deposition (PVD)
3
Atomic Layer Etching (ALE)
2
Capacitively Coupled Plasma (CCP)
18
Reactive Ion Etching (RIE)
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Which job functions commonly mention Physical Vapor Deposition (PVD)?

Research Scientist
20 Research Scientist jobs mention Physical Vapor Deposition (PVD)
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Mechanical Engineer
21 Mechanical Engineer jobs mention Physical Vapor Deposition (PVD)
View 21 jobs on Sumble
Researcher
35 Researcher jobs mention Physical Vapor Deposition (PVD)
View 35 jobs on Sumble
Engineer
261 Engineer jobs mention Physical Vapor Deposition (PVD)
View 261 jobs on Sumble
Facilities
26 Facilities jobs mention Physical Vapor Deposition (PVD)
View 26 jobs on Sumble
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