BGAS
**BGAS**
What is BGAS?
BGAS most likely refers to Ball Grid Array Substrate. This is a type of substrate used in the manufacturing of Ball Grid Array (BGA) integrated circuits. The substrate provides mechanical support and electrical connections between the silicon die and the printed circuit board (PCB). BGAS is commonly used to provide high-density interconnects, improved electrical performance, and better thermal management for BGA packages. The term is most commonly used in context of IC manufacturing, PCB design and electronics assembly.
Which job functions commonly mention BGAS?
Which organizations are mentioning BGAS?
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